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26 ñåíòÿáðÿ 2005 ãîäà

3rd World Congress for Software Quality

Modern daily life is heavily dependent on computerized systems and thus on the quality of the software inside these systems. The increasing number of processors used in everyday life is creating a strong demand for projects that will deliver software solutions. For these projects we either need more people possessing software engineering skills, or we have to increase productivity by developing new technology, whereby an even better quality will be achieved.

The 2005 3rd World Congress for Software Quality will bring together leading experts from both the academic and industry sectors to share ideas, insights, and experiences, and to demonstrate advances in software quality, software process improvement, and software development methods.

The World Congress for Software Quality is held once every 5 years and hosted alternatively by the three main organizers: the ASQ (American Society for Quality), the JUSE (Union of Japanese Scientists and Engineers), and the EOQ (European Organization for Quality). The 1st World Congress for Software Quality was held in San Francisco in 1995, the 2nd in Yokohama in 2000, and the 3rd is to be held in Munich.

The 3rd World Congress for Software Quality happens to coincide with the traditional Oktoberfest celebration in Munich, being scheduled for September 26 - 30, 2005. During the five days of the Congress tutorials, workshops, panel discussions, paper and keynote sessions and an exhibition of software tool vendors will be offered, as well as excursions to the research laboratories of the major sponsors. Social events, a ladies program, receptions and other events will provide participants with opportunities to meet experts and VIP’s in the software engineering business. 

More information - http://www.asqf.de/asqf/deu/conf/wcsq/3/


  Ðåêîìåíäîâàòü ñòðàíèöó   Îáñóäèòü ìàòåðèàë Íàïèñàòü ðåäàêòîðó  
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  Äàòà ïóáëèêàöèè: 14.04.2004  

ÎÁ ÀËÜßÍÑÅ | ÍÀØÈ ÓÑËÓÃÈ | ÊÀÒÀËÎà ÐÅØÅÍÈÉ | ÈÍÔÎÐÌÀÖÈÎÍÍÛÉ ÖÅÍÒÐ | ÑÒÀÍÜÒÅ ÑÏÎÍÑÎÐÀÌÈ SILICON TAIGA | ISDEF | ÊÍÈÃÈ È CD | ÏÐÎÃÐÀÌÌÍÎÅ ÎÁÅÑÏÅ×ÅÍÈÅ | ÓÏÐÀÂËÅÍÈÅ ÊÀ×ÅÑÒÂÎÌ | ÐÎÑÑÈÉÑÊÈÅ ÒÅÕÍÎËÎÃÈÈ | ÍÀÍÎÒÅÕÍÎËÎÃÈÈ | ÞÐÈÄÈ×ÅÑÊÀß ÏÎÄÄÅÐÆÊÀ | ÀÍÀËÈÒÈÊÀ | ÊÀÐÒÀ ÑÀÉÒÀ | ÊÎÍÒÀÊÒÛ

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